This inventor holds 4 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignees: Siemens Aktiengesellschaft, Vitesco Technologies Gmbh. Active years: 2004-2020.
Company Filing History:
Years Active: 2004-2020
Title: Waldemar Brinkis: Innovator in Printed Circuit Board Technology
Introduction
Waldemar Brinkis is a notable inventor based in Nidderau, Germany. He has made significant contributions to the field of printed circuit board technology, holding a total of 4 patents. His innovative methods have advanced the manufacturing processes of circuit boards, showcasing his expertise and dedication to the industry.
Latest Patents
Brinkis's latest patents include a method for through-plating a printed circuit board and the design of a printed circuit board and sensor. The method for through-plating involves filling holes under compression pressure with a sintering paste, which is then dried and fired to create a cohesive bond with the ceramic substrate. This process allows for the simultaneous filling of multiple holes with varying diameters using a single print parameter set. The printed circuit board design features conductor tracks on one side of a substrate, which is cohesively bonded to a protective cover, preventing any wetting of the conductor tracks with auxiliary materials.
Career Highlights
Throughout his career, Waldemar Brinkis has worked with prominent companies such as Siemens and Vitesco Technologies. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects in the field of electronics.
Collaborations
Brinkis has collaborated with notable colleagues, including Erich Mattmann and Bernd Thyzel. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in printed circuit board manufacturing.
Conclusion
Waldemar Brinkis is a distinguished inventor whose work in printed circuit board technology has made a lasting impact on the industry. His innovative patents and collaborations reflect his commitment to advancing technology and improving manufacturing processes.