Hong Kong, China

Wai Ming Edwin Cheung

This inventor holds 1 USPTO granted patent. Top assignee: Hong Kong R&d Centre for Logistics and Supply Chain Management Enabling Technologies Limited. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wai Ming Edwin Cheung. Retrieved from https://idiyas.com/inventor/wai-ming-edwin-cheung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations by Wai Ming Edwin Cheung

Introduction

Wai Ming Edwin Cheung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of robotics and labeling systems. With a focus on enhancing efficiency in logistics, his work has garnered attention in the industry.

Latest Patents

Wai Ming Edwin Cheung holds a patent for a "System for placing a label on an object, a method thereof and an effector for a robotic system." This innovative system includes a scanning module that identifies suitable label placement positions based on predefined parameters. The robotic controlled apparatus is designed to extract labels from a substrate and apply them accurately to objects, ensuring proper adherence.

Career Highlights

Cheung is associated with the Hong Kong R&D Centre for Logistics and Supply Chain Management Enabling Technologies Limited. His role in this organization allows him to work on cutting-edge technologies that improve supply chain processes. His expertise in robotics and automation has positioned him as a valuable asset in his field.

Collaborations

Wai Ming Edwin Cheung collaborates with various professionals, including his coworker Ka Lun Fan. Their combined efforts contribute to the advancement of innovative solutions in logistics and supply chain management.

Conclusion

Wai Ming Edwin Cheung's contributions to the field of robotics and labeling systems highlight his innovative spirit and dedication to improving logistics. His patent and work at the Hong Kong R&D Centre demonstrate his commitment to advancing technology in this vital industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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