Hong Kong, China

Wai Ming Chan

This inventor holds 1 USPTO granted patent. Top assignee: City University of Hong Kong. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wai Ming Chan. Retrieved from https://idiyas.com/inventor/wai-ming-chan-gdh8sqlo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations of Wai Ming Chan in Wireless Communication

Introduction

Wai Ming Chan is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of wireless communication. His innovative work has led to the development of a unique precoder device that enhances communication systems.

Latest Patents

Wai Ming Chan holds 1 patent for his invention titled "Wireless communication system and a precoder device for use in such system." This patent describes a wireless communication system that includes a precoder device designed to introduce a delay to multiple sub-channels of a signal at the transmitter end. The delay is associated with the processing time of a receiver component at the receiver end of the communication system.

Career Highlights

Wai Ming Chan is affiliated with the City University of Hong Kong, where he continues to engage in research and development in the field of wireless technologies. His work has been instrumental in advancing the capabilities of communication systems.

Collaborations

Some of his notable coworkers include Chi Wah Kok and Wing Shan Tam. Their collaborative efforts contribute to the innovative projects at the university.

Conclusion

Wai Ming Chan's contributions to wireless communication technology exemplify the impact of innovative thinking in modern communication systems. His work continues to influence the field and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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