Hong Kong, China

Wai Kwan Cheung

This inventor holds 3 USPTO granted patents. Top assignees: The Hospital Authority, Other. Active years: 2002-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wai Kwan Cheung. Retrieved from https://idiyas.com/inventor/wai-kwan-cheung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2002-2026

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3 patents (USPTO):Explore Patents

Title: Innovations by Wai Kwan Cheung

Introduction

Wai Kwan Cheung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of thermal management through his innovative designs. With a total of 3 patents, Cheung has developed solutions that enhance heat dissipation efficiency.

Latest Patents

One of his latest patents is the "Efficient Cooler." This invention features a high-efficiency heat sink that comprises a U-shaped copper tube and a press-formed sealed vacuum vessel made of pure copper sheet. The sealed vacuum vessel contains fibers that are strongly absorbent and impregnated with a refrigerant. The thermal energy effect of the surface with which the inhibited glycol refrigerant is in contact causes the glycol to vaporize and ascend into the orifice of the U-shaped copper tube. A fan cools the orifice of the U-shaped copper tube of the evaporator, condensing the vapor back into liquid, which then flows back into the sealed vacuum vessel, thus forming a cyclic type heat exchanger and achieving optimum heat dispersal.

Another significant patent is the "Heat Sink." This invention includes a first and a second group of heat dissipating members that are integrally formed and extend upwardly from a base portion. The first group consists of a plurality of fin-shaped members, each having main heat dissipation surfaces surrounded by thin peripheral edges. The thin peripheral top edges extend from the interior of the base portion towards the outside periphery. The main heat dissipation surfaces on adjacent members are substantially opposing to each other, while the second group of heat dissipation members is positioned between the first group and the center of the base portion.

Career Highlights

Wai Kwan Cheung has established himself as a prominent figure in the field of thermal management. His innovative designs have garnered attention for their efficiency and effectiveness in heat dissipation. His work continues to influence the industry and inspire future innovations.

Collaborations

Due to space constraints, the collaborations section will be omitted.

Conclusion

Wai Kwan Cheung's contributions to thermal management through his patents demonstrate his innovative spirit and commitment to enhancing technology. His inventions are paving the way for more efficient heat dissipation solutions in various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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