Chicago, IL, United States of America

Wai Fung Lai

This inventor holds 1 USPTO granted patent. Top assignee: Richco Inc.. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wai Fung Lai. Retrieved from https://idiyas.com/inventor/wai-fung-lai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: The Innovations of Wai Fung Lai

Introduction

Wai Fung Lai is an accomplished inventor based in Chicago, IL. He has made significant contributions to the field of technology, particularly with his innovative designs and solutions. His work is characterized by a commitment to enhancing functionality and efficiency in electronic devices.

Latest Patents

Wai Fung Lai holds a patent for a Dual Locking Circuit Board Support. This invention showcases his ability to address common challenges in circuit board design, providing a reliable solution that enhances the stability and performance of electronic assemblies. He has 1 patent to his name, reflecting his innovative spirit and technical expertise.

Career Highlights

Wai Fung Lai is currently employed at Richco Inc., a company known for its dedication to providing high-quality electronic components and solutions. His role at Richco Inc. allows him to apply his inventive skills in a practical setting, contributing to the development of cutting-edge products that meet the needs of the industry.

Collaborations

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Conclusion

Wai Fung Lai's contributions to the field of technology through his patent and work at Richco Inc. highlight his innovative mindset and dedication to improving electronic design. His achievements serve as an inspiration for aspiring inventors and professionals in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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