This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignees: Nano and Advanced Materials Institute Limited, Amperex Technology Limited. Active years: 2025-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
2 out of 155 
1 out of 8 Years Active: 2025-2026
Title: Innovations of Wai Chung Li in Electromagnetic Interference Shielding
Introduction
Wai Chung Li is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electromagnetic interference (EMI) shielding. His innovative work focuses on developing advanced materials that enhance thermal conductivity while providing effective EMI protection.
Latest Patents
Wai Chung Li holds a patent for an "Electromagnetic interference shielding device comprising a flame retarding, thermal interface material composite, and method for preparation thereof." This invention presents an EMI shielding device that includes a flame-retarding, thermal interface material composite. The composite features a through-plane thermal conductivity of no less than 30 W/mK and a dielectric withstanding voltage of no less than 1 kV/mm. The design incorporates at least one dielectric layer of self-aligned, carbon-based materials associated with superparamagnetic particles. Additionally, it includes a layer of fillers that blends dielectric heat transfer materials with a thermal or UV curable polymer or phase change polymer. The alignment of anisotropic heat transfer carbon-based materials under a low magnetic field strength results in a high thermal conductivity direction, optimizing heat conduction from adjacent devices.
Career Highlights
Wai Chung Li is affiliated with the Nano and Advanced Materials Institute Limited, where he continues to push the boundaries of material science. His work is characterized by a commitment to innovation and practical applications in technology.
Collaborations
Wai Chung Li collaborates with esteemed colleagues such as Chi Ho Kwok and Xiaohua Chen. Their combined expertise contributes to the advancement of research and development in the field of advanced materials.
Conclusion
Wai Chung Li's contributions to electromagnetic interference shielding represent a significant advancement in material technology. His innovative patent showcases the potential for improved thermal management and EMI protection in various applications. The impact of his work is likely to influence future developments in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile