The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Nov. 19, 2021
Applicant:

Nano and Advanced Materials Institute Limited, Hong Kong, HK;

Inventors:

Chi Ho Kwok, Hong Kong, HK;

Xiaohua Chen, Hong Kong, HK;

Wai Chung Li, Hong Kong, HK;

Chenmin Liu, Hong Kong, HK;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); C01B 32/21 (2017.01); H01F 1/00 (2006.01); H01F 1/34 (2006.01); B82Y 25/00 (2011.01); B82Y 30/00 (2011.01); C01G 49/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); C01B 32/21 (2017.08); H01F 1/0018 (2013.01); H01F 1/344 (2013.01); B82Y 25/00 (2013.01); B82Y 30/00 (2013.01); C01G 49/08 (2013.01); C01P 2004/20 (2013.01); C01P 2004/64 (2013.01); C01P 2006/40 (2013.01); C01P 2006/42 (2013.01);
Abstract

The present invention provides an EMI shielding device including a flame retarding, thermal interface material composite with a through plane thermal conductivity of no less than 30 W/mK and a dielectric withstanding voltage of no less than 1 kV/mm, where the composite includes at least one dielectric layer of self-aligned, carbon-based materials associated with superparamagnetic particles and at least one layer of fillers including a blend of dielectric heat transfer materials with a thermal or UV curable polymer or phase change polymer. The anisotropic heat transfer carbon-based materials associated with superparamagnetic materials are aligned under a low magnetic field strength of less than 1 Tesla to an orientation that results in a high thermal conductivity direction which can conduct the maximum heat from the adjacent device of the present composite. The present invention also provides a method for preparing the composite.


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