W Mark Dutt

Title: W Mark Dutt: Innovator in Multilayered Metallocene Stretch Wrap Films

Introduction

W Mark Dutt is a notable inventor based in Gurnee, Illinois. He has made significant contributions to the field of packaging through his innovative work on multilayered metallocene stretch wrap films. His expertise in polymer technology has led to advancements that enhance the performance and efficiency of stretch wrap materials.

Latest Patents

Dutt holds a patent for a multilayer, thermoplastic stretch wrap film that consists of at least four polymeric film layers. This innovative film features a first outer cling layer, a second outer cling layer, at least one inner polymeric layer, and a core layer. The cling force between the first and second layers is at least about 140 grams per inch. The inner polymeric layer is made from a low polydispersity polymer, which has specific properties that enhance the film's performance. The core layer can be composed of various materials, including random copolymers and polypropylene homopolymers, allowing for versatility in application. The multilayer stretch wrap film boasts a maximum stretch of at least 340% and a machine direction stress force at 200% elongation of between about 1400 and about 1900 psi.

Career Highlights

W Mark Dutt is associated with Tenneco Packaging Inc., where he has applied his knowledge and skills to develop advanced packaging solutions. His work has not only contributed to the company's product offerings but has also set new standards in the industry.

Collaborations

Dutt has collaborated with notable colleagues, including George N Eichbauer and Richard E Leone, to further enhance the development of innovative packaging technologies.

Conclusion

W Mark Dutt's contributions to the field of multilayered metallocene stretch wrap films exemplify his commitment to innovation in packaging technology. His work continues to influence the industry and improve the efficiency of packaging solutions.