This inventor holds 5 USPTO granted patents. Top assignee: Hypres, Inc.. Active years: 2012-2019.
Company Filing History:
Years Active: 2012-2019
Title: Innovations by Vladimir V Dotsenko
Introduction
Vladimir V Dotsenko is a notable inventor based in Mahopac, NY (US). He has made significant contributions to the field of electrical engineering, particularly in the development of advanced electronic modules. With a total of 5 patents to his name, Dotsenko's work focuses on innovative methods for interconnecting electronic substrates.
Latest Patents
Among his latest patents is a method for electrically interconnecting at least two substrates and a multichip module. This method involves aligning the electrical contacts of two substrates, applying a liquid curable adhesive, and compressing the substrates to ensure electrical communication. The adhesive is then cured to form a solid matrix that maintains the compression between the contacts. Another significant patent is for a superconductive multi-chip module designed for high-speed digital circuits, which also operates at cryogenic temperatures. These innovations highlight Dotsenko's expertise in creating efficient and high-performance electronic systems.
Career Highlights
Vladimir V Dotsenko is currently associated with Hypres, Inc., a company known for its advancements in superconducting electronics. His work at Hypres has been instrumental in pushing the boundaries of technology in the field of high-speed circuits. Dotsenko's patents reflect his commitment to enhancing the performance and reliability of electronic devices.
Collaborations
Due to space constraints, the details of collaborations will not be included.
Conclusion
Vladimir V Dotsenko's contributions to the field of electrical engineering through his innovative patents demonstrate his significant impact on technology. His work continues to influence the development of advanced electronic systems.