Vladimin Vaganov

Title: Vladimin Vaganov: Innovator in Photonic Component Packaging

Introduction

Vladimin Vaganov is a notable inventor based in Los Gatos, California. He has made significant contributions to the field of photonics, particularly in the packaging of photonic components. His innovative approach has led to the development of a unique method that enhances the functionality and efficiency of photonic devices.

Latest Patents

Vaganov holds a patent for a "Photonic component package and method of packaging." This invention provides a method of packaging a photonic component and includes a package that comprises a package body and a set of pins. The orientation of the pins is designed to not increase the footprint requirements of the package when mounted onto a module. The semiconductor die, which may include a movable mirror, is attached to and enclosed within the package. Additionally, an optical fiber is attached in a parallel orientation to the mounting surface of the module. The package is designed to be a low-cost part with pins attached on a pinout side, and it features an optional photonic inlet that can be coupled with external photonic elements.

Career Highlights

Vladimin Vaganov is currently associated with Megasense, Inc., where he continues to innovate in the field of photonics. His work focuses on developing cost-effective solutions that enhance the performance of photonic components. His patent reflects his commitment to advancing technology in this area.

Collaborations

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Conclusion

Vladimin Vaganov's contributions to photonic component packaging demonstrate his innovative spirit and dedication to advancing technology. His patent showcases a practical solution that addresses the needs of the industry, making him a significant figure in the field of photonics.