Louisville, CO, United States of America

Vlad V Chumanchenko

This inventor holds 1 USPTO granted patent. Top assignee: Omnivision Technologies, Inc.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vlad V Chumanchenko. Retrieved from https://idiyas.com/inventor/vlad-v-chumanchenko

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Vlad V Chumanchenko: Innovator in Integrated Die-Level Camera Technology

Introduction

Vlad V Chumanchenko is a notable inventor based in Louisville, Colorado. He has made significant contributions to the field of camera technology, particularly with his innovative work on integrated die-level cameras. His expertise and creativity have led to advancements that enhance imaging systems.

Latest Patents

Chumanchenko holds a patent for an "Integrated die-level cameras and methods of manufacturing the same." This patent describes a sophisticated camera system that includes a first die-level camera and a second die-level camera, both formed at least partially in a die. The design incorporates baffling to block stray light between the two cameras, improving image quality and performance. He has 1 patent to his name.

Career Highlights

Vlad V Chumanchenko is currently employed at Omnivision Technologies, Inc., a company renowned for its advancements in imaging technology. His role at Omnivision has allowed him to work on cutting-edge projects that push the boundaries of camera systems.

Collaborations

Chumanchenko collaborates with talented individuals in his field, including Dennis J Gallagher and Adam Douglas Greengard. These partnerships foster innovation and contribute to the development of new technologies.

Conclusion

Vlad V Chumanchenko is a prominent figure in the realm of integrated die-level camera technology. His contributions and collaborations continue to shape the future of imaging systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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