Vivian Ruth Corbin

Title: Vivian Ruth Corbin: Innovator in Thin Film Interconnection Systems

Introduction

Vivian Ruth Corbin is a notable inventor based in Wappingers Falls, NY (US). She has made significant contributions to the field of thin film interconnection systems. Her innovative work has led to the development of a patented method that enhances the efficiency of electronic devices.

Latest Patents

Vivian holds a patent for "Forming self-aligned via holes in thin film interconnection systems." This method involves creating self-aligned via holes that are essential for interconnecting various levels of thin films atop substrates. The process begins with forming a first level thin film pattern, typically consisting of raised metallic stripes, on the substrate. A dielectric material is then deposited to conform to the pattern's topology. Following this, a polymer is applied to create a planar surface, with a thicker accumulation between the insulator's protuberances. A mask is used to define regions for via holes, which are then etched to expose the insulator and form accurately located via holes, even in cases of mask misalignment. This innovative approach has the potential to improve the reliability and performance of electronic components.

Career Highlights

Vivian is currently employed at International Business Machines Corporation (IBM), where she continues to contribute to advancements in technology. Her work at IBM has allowed her to collaborate with other talented professionals in the field.

Collaborations

Some of her notable coworkers include Bisweswar Patnaik and Chung-Yu Ting. Their collaborative efforts have furthered the development of innovative solutions in thin film technology.

Conclusion

Vivian Ruth Corbin's contributions to the field of thin film interconnection systems exemplify her dedication to innovation and technology. Her patented methods are paving the way for advancements in electronic device performance.