This inventor holds 1 USPTO granted patent. Top assignee: Motorola Corporation. Active years: 1991.
Company Filing History:
Years Active: 1991
Title: The Innovative Contributions of Virgil E Schuster
Introduction
Virgil E Schuster is a notable inventor based in Scottsdale, AZ (US). He has made significant contributions to the field of electroplating through his innovative methods and apparatus. His work has been recognized for its impact on the uniformity of metallized bumps on substrates.
Latest Patents
Virgil E Schuster holds a patent for a "Method and apparatus for adjusting plating solution flow characteristics." This invention focuses on electroplating metallized bumps of substantially uniform height on predetermined terminal areas of a substrate. The cup plating apparatus he developed includes elements for adjusting parameters that affect the geometry of the substrate relative to the plating cup, as well as the flow rate of the electroplating solution against the substrate surface. By achieving non-laminar flow of the electroplating solution near the substrate edges, the plating characteristics are altered, effectively offsetting the 'edge effect.' This results in a substantially uniform bump height across the substrate.
Career Highlights
Virgil E Schuster has had a distinguished career, primarily working with Motorola Corporation. His innovative approach to electroplating has set new standards in the industry, showcasing his expertise and commitment to advancing technology.
Collaborations
Throughout his career, Schuster has collaborated with notable colleagues, including Reginald K Asher and Bhagubhai D Patel. These collaborations have further enriched his work and contributed to the success of his inventions.
Conclusion
Virgil E Schuster's contributions to the field of electroplating demonstrate his innovative spirit and dedication to improving manufacturing processes. His patent reflects a significant advancement in achieving uniformity in electroplated components.