Montreal, Canada

Virak Siev

USPTO Granted Patents = 23 

 

Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 200(Granted Patents)


Location History:

  • Pointe-Claire, CA (2008 - 2011)
  • Montreal, CA (2010 - 2023)

Company Filing History:


Years Active: 2008-2025

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23 patents (USPTO):Explore Patents

Title: The Innovative Mind of Virak Siev

Introduction: Virak Siev, based in Montreal, Canada, is an accomplished inventor with a remarkable portfolio of 21 patents to his name. His work primarily focuses on innovating connector systems that improve the quality of signal transmission, particularly in high-frequency applications.

Latest Patents: Virak's latest inventions include a series of compensating connector systems. The first patent describes a compensating plug connector that includes a plug, a receptacle mating zone, a cable mating zone, and an intermediate zone. Each of these zones is engineered to ensure that Near End Cross Talk (NEXT) resulting from the transmission of high-frequency signals remains below a specified threshold. This design effectively minimizes interference, ensuring optimal performance in various cabling categories. The second patent introduces a compensating receptacle connector designed for terminating cable assemblies, similarly structured to maintain low NEXT levels across its zones.

Career Highlights: Throughout his career, Virak has demonstrated a commitment to enhancing telecommunications through innovative designs. His notable affiliations include working with Belden CDT (Canada) Inc. and Belden Canada Inc., where he contributed to cutting-edge advancements in connector technology.

Collaborations: Virak has also collaborated with respected colleagues, including Luc Milette and François Beauregard. These partnerships have allowed for a dynamic exchange of ideas and further innovation within their field.

Conclusion: Virak Siev exemplifies the spirit of innovation in the technology sector. His extensive patent portfolio and collaborations reflect his dedication to improving connectivity solutions, making a significant impact on the industry and setting the stage for future advancements.

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