Koblenz, Germany

Vincent Leon

This inventor holds 1 USPTO granted patent and 2 published patent applications and 1 EPO patent. Top assignee: Lohmann Gmbh & Co Kg. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vincent Leon. Retrieved from https://idiyas.com/inventor/vincent-leon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Vincent Leon - Innovator in Adhesive Technology

Introduction

Vincent Leon is a notable inventor based in Koblenz, Germany. He has made significant contributions to the field of adhesive technology, particularly with his innovative adhesive compound. His work has implications for various industries, especially in automotive applications.

Latest Patents

Vincent Leon holds 1 patent for an adhesive compound. This invention involves a multi-armed vinyl aromatic block copolymer, one or more adhesive resins, and auxiliary crosslinking agents. The adhesive means developed from this compound demonstrates improved adhesion to hard, non-polar surfaces, which is particularly beneficial for novel coated surfaces in the automotive industry.

Career Highlights

Leon is associated with Lohmann GmbH & Co. KG, where he has been instrumental in advancing adhesive technologies. His expertise in developing high-performance adhesive solutions has positioned him as a key player in the industry.

Collaborations

Vincent collaborates with talented coworkers, including Patrik Kopf and Simone Wierschem. Their combined efforts contribute to the innovative projects at Lohmann GmbH & Co. KG.

Conclusion

Vincent Leon's contributions to adhesive technology highlight his role as an innovator in the field. His patent for an advanced adhesive compound showcases his commitment to improving adhesion solutions for various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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