Enniscorthy, Ireland

Vincent Hodnett

This inventor holds 1 USPTO granted patent. Top assignee: Taoglas Group Holdings Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vincent Hodnett. Retrieved from https://idiyas.com/inventor/vincent-hodnett

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Vincent Hodnett and Transparent Antenna Innovation

Introduction

Vincent Hodnett is an inventor associated with Enniscorthy, Ireland, and Taoglas Group Holdings Limited. His patent work concerns transparent antenna technology designed to combine wireless connectivity with transparent materials.

Latest Patents

Hodnett is associated with 1 patent: “Transparent Antenna Assembly with Flexible Transparent Antenna.” The invention describes a flexible transparent antenna built on a transparent flexible substrate and configured to operate within a desired frequency band. A transparent substrate interface assembly connects the antenna to a connector subassembly, which includes a printed circuit board mount connector and a radio-frequency connector for signal communication.

Career Highlights

Hodnett’s listed patent reflects work on antenna assemblies that can be integrated with transparent surfaces while maintaining wireless signal connections. His association with Taoglas Group Holdings Limited places this invention within the company’s antenna and connectivity technology work.

Collaborations

William Levingstone and Baha Badran are identified as Hodnett’s coworkers. Their names provide context for his professional connections, though the supplied information does not specify their roles in the patent.

Conclusion

Vincent Hodnett’s patent on a flexible transparent antenna highlights an approach to integrating wireless connectivity into transparent materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…