Location History:
- Bainbridge Twp., Cuyahoga County, OH (US) (1994)
- Chagrin Falls, OH (US) (1997 - 2008)
Company Filing History:
Years Active: 1994-2008
Title: Innovations of Vincent C. Opaskar
Introduction
Vincent C. Opaskar is a notable inventor based in Chagrin Falls, Ohio. He holds a total of four patents, showcasing his contributions to the field of electroplating and alloy development. His work has significantly impacted the industry, particularly in the creation of advanced electroplating systems.
Latest Patents
Opaskar's latest patents include innovative articles with electroplated zinc-nickel ternary and higher alloys. These patents detail an electroplating bath, a system, and a process for depositing a zinc-nickel ternary or higher alloy. The process involves zinc ions, nickel ions, and various ionic species, which enhance the properties of conductive substrates. Another significant patent focuses on a plating bath and method for electroplating tin-zinc alloys. This invention utilizes an aqueous plating bath containing bath-soluble stannous and zinc salts, along with a quaternary ammonium polymer. The resulting plating baths are designed to produce bright and level deposits, adaptable for high tin concentration across a wide current density range.
Career Highlights
Throughout his career, Vincent C. Opaskar has worked with prominent companies such as Atotech Deutschland GmbH and Atotech USA, Inc. His experience in these organizations has allowed him to refine his expertise in electroplating technologies and contribute to various innovative projects.
Collaborations
Opaskar has collaborated with notable coworkers, including Lee Capper and Paul Christopher Wynn. Their combined efforts have further advanced the field of electroplating and alloy development.
Conclusion
Vincent C. Opaskar's contributions to electroplating and alloy innovations have established him as a significant figure in the industry. His patents reflect a commitment to enhancing the properties of conductive materials through advanced electroplating techniques.