Vijesh Unnikrishnan is an accomplished inventor based in Minneapolis, MN (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of flip chip die assembly. With a total of 2 patents to his name, his work focuses on enhancing the efficiency and effectiveness of thin flexible substrates used in integrated circuits.

Latest Patents

One of Vijesh's latest patents is titled "Flip chip die assembly using thin flexible substrates." This invention outlines apparatus and methods for flattening thin substrate surfaces by stretching these substrates to which integrated circuits (ICs) can be bonded. Various embodiments of this invention beneficially maintain substrate flatness during the assembly process through singulation. The use of a window frame type component carrier allows for the processing of thin laminates and flex films through various manufacturing processes.

In this innovative approach, the flexible substrate is bonded to a rigid carrier, which is placed into a specialized fixture comprising a bottom plate and a top plate. The bottom plate features raised regions that allow the windowed region of the flex film to be pressed flat. After aligning the top plate, bottom plate, and middle structure, the plates are pressed together. This action causes the raised regions to push the flex film substrate upward and around the carrier. By pressing the thin substrate upward, it is stretched like a drum head over the raised sections of the bottom plate, thereby flattening the substrate. The die assembly site is held flat over the raised portion of the carrier to provide a stable base for the placement of the die.

Career Highlights

Vijesh Unnikrishnan is currently employed at Cardiac Pacemakers, Inc., where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing the capabilities of flip chip die assembly, making significant strides in the manufacturing processes involved.

Collaborations

Throughout his career, Vijesh has collaborated with notable colleagues, including David J. Smith and Anthony A. Primavera. These collaborations have further enriched his work and contributed to the development of innovative solutions in the industry.

Conclusion

Vijesh Unnikrishnan's contributions to the field of semiconductor technology, particularly through his patents on flip chip die assembly, demonstrate his commitment to innovation. His work