Lincoln, NE, United States of America

Vijayaraghavan Rajagopal


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2022-2024

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3 patents (USPTO):Explore Patents

Title: Innovations of Vijayaraghavan Rajagopal

Introduction

Vijayaraghavan Rajagopal is an accomplished inventor based in Lincoln, NE (US). He holds a total of three patents, showcasing his expertise in the field of thermal interface materials. His work has significantly contributed to advancements in technology and materials science.

Latest Patents

Rajagopal's latest patents include innovative compressible foamed thermal interface materials and methods of making the same. These patents disclose exemplary embodiments of compressible foamed thermal interface materials, along with methods for their production and application. His contributions in this area are vital for improving thermal management in various applications.

Career Highlights

Throughout his career, Vijayaraghavan Rajagopal has worked with notable companies, including Laird Technologies GmbH. His experience in the industry has allowed him to develop and refine his inventions, making a lasting impact on the field.

Collaborations

Rajagopal has collaborated with esteemed colleagues such as Eugene Anthony Pruss and Richard F. Hill. These partnerships have fostered a creative environment that has led to significant innovations in thermal interface materials.

Conclusion

Vijayaraghavan Rajagopal's contributions to the field of thermal interface materials through his patents and collaborations highlight his role as a key innovator. His work continues to influence advancements in technology and materials science.

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