Boulder, CO, United States of America

Vani Sundaram

This inventor holds 1 USPTO granted patent. Top assignee: University of Colorado. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vani Sundaram. Retrieved from https://idiyas.com/inventor/vani-sundaram

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Vani Sundaram: Innovator in Soft Robotics

Introduction

Vani Sundaram is an accomplished inventor based in Boulder, Colorado. She has made significant contributions to the field of soft robotics, particularly through her innovative patent related to magnetic sensing.

Latest Patents

Vani Sundaram holds a patent titled "Embedded magnetic sensing for soft actuators." This invention presents a magnetic sensing approach for determining a positioning characteristic of a soft robotic actuator. The technology involves measuring a magnetic field or a change in the magnetic field of a magnetic member as it undergoes concurrent displacement with a soft actuator. Additionally, the patent illustrates an example of a rolling robotic wheel that utilizes the described magnetic sensing.

Career Highlights

Vani Sundaram is affiliated with the University of Colorado, where she continues to advance her research in robotics. Her work has garnered attention for its potential applications in various fields, including robotics and automation.

Collaborations

Vani collaborates with notable colleagues such as Khoi Ly and Jatin Mayekar, contributing to a dynamic research environment that fosters innovation.

Conclusion

Vani Sundaram's contributions to soft robotics through her patent and research at the University of Colorado highlight her role as a leading inventor in this emerging field. Her work exemplifies the intersection of technology and creativity, paving the way for future advancements in robotics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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