Webster, NY, United States of America

Van W Huston

This inventor holds 1 USPTO granted patent. Top assignee: Eastman-Kodak Company. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Van W Huston. Retrieved from https://idiyas.com/inventor/van-w-huston

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Van W Huston: Innovator in Bottle Closure Technology

Introduction

Van W Huston is a notable inventor based in Webster, NY (US). He has made significant contributions to the field of bottle and closure assembly technology. His innovative designs have paved the way for improved functionality in everyday products.

Latest Patents

Huston's most recent patent is for a "Bottle and bottle closure assembly." This invention focuses on a system for draining a solution contained within a bottle. The assembly includes a base section, a body portion, and a neck portion with an outlet for the solution. A seal is secured to the neck to retain the solution, while a cap member features rupture members designed to assist in breaking the seal.

Career Highlights

Van W Huston is associated with Eastman Kodak Company, where he has applied his expertise in product design and innovation. His work has contributed to the development of practical solutions in the packaging industry.

Collaborations

Huston has collaborated with notable colleagues, including Richard W Bauer and Theodore K Ricks. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Van W Huston is a distinguished inventor whose work in bottle closure technology exemplifies the spirit of innovation. His contributions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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