Busto Arsizio, Italy

Valter Tinivella

This inventor holds 1 USPTO granted patent. Top assignee: Ilapak Research & Development S.a.. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Valter Tinivella. Retrieved from https://idiyas.com/inventor/valter-tinivella

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Valter Tinivella: Innovator in Packaging Technology

Introduction

Valter Tinivella is a notable inventor based in Busto Arsizio, Italy. He has made significant contributions to the field of packaging technology, particularly in the development of systems that enhance the efficiency of bag production.

Latest Patents

Valter Tinivella holds a patent for a "Station for applying segments of openable/reclosable strip on a plastic film web destined to form bags." This innovative station includes a device for sealing segments of strip at intervals on the film and a device for punching predefined zones of the film. The design allows for the punching and sealing operations to occur in sequence, ensuring that the film remains stationary during these processes. This advancement streamlines the production of bags, making it more efficient and effective.

Career Highlights

Valter Tinivella is associated with Ilapak Research & Development S.a., where he continues to work on innovative solutions in packaging technology. His expertise and dedication to improving manufacturing processes have made him a valuable asset in his field.

Collaborations

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Conclusion

Valter Tinivella's contributions to packaging technology through his innovative patent demonstrate his commitment to enhancing production efficiency. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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