Summit, NJ, United States of America

Uziel Landau

This inventor holds 2 USPTO granted patents. Top assignee: Bell Telephone Laboratories. Active years: 1977-1978.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Uziel Landau. Retrieved from https://idiyas.com/inventor/uziel-landau-7056occs

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 20(Granted Patents)


Company Filing History:


Years Active: 1977-1978

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2 patents (USPTO):Explore Patents

Title: Uziel Landau: Innovator in Electroplating Technology

Introduction

Uziel Landau is a notable inventor based in Summit, NJ (US), recognized for his contributions to the field of electroplating technology. With a total of 2 patents, Landau has developed innovative methods that enhance the efficiency and effectiveness of metal plating processes, particularly in electronic applications.

Latest Patents

One of Landau's significant inventions is a process for gold plating. This invention focuses on rapidly electroplating metals such as gold, nickel, and tin-lead alloys on contact fingers for electronic printed wiring boards. A key aspect of this process is the uniform distribution of current among the fingers, which ensures that the metal plating is uniform in thickness. Additionally, the process allows for the adjustment of thickness among individual fingers, optimizing metal usage where it is most needed. This innovation is particularly valuable given the high cost of gold and its increasing use in electronics.

Another important patent by Landau is a method of electroplating precious metals in localized areas. This method addresses the common issue of nonuniform deposits by utilizing shaped anodes that are positioned closely to the cathodes. By employing high parallel flow rates of electrolyte and high current densities, this technique allows for quick electroplating of precious metals, primarily gold, in specific areas of electronic circuits and components. This targeted approach not only improves efficiency but also offers significant economic savings.

Career Highlights

Uziel Landau has made substantial contributions to the field of electroplating while working at Bell Telephone Laboratories. His work has been instrumental in advancing the technology used in electronic manufacturing, particularly in the area of metal coatings.

Collaborations

Landau has collaborated with notable individuals in his field, including Donald Eldridge Koontz, to further enhance the development of electroplating technologies.

Conclusion

Uziel Landau's innovative work in electroplating has significantly impacted the electronics industry, providing efficient solutions for metal plating processes. His patents reflect a commitment to advancing technology while addressing economic considerations in manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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