This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2009.
Company Filing History:
Years Active: 2009
Title: Uu-Byung Kang: Innovator in Alloy Solder Technology
Introduction
Uu-Byung Kang is a notable inventor based in Hwaseong, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative work on alloy solder.
Latest Patents
Uu-Byung Kang holds a patent for a tin-bismuth (Sn-Bi) family alloy solder and a semiconductor device utilizing this alloy. This invention focuses on enhancing the reliability of the junction between a semiconductor chip and a substrate. The patent outlines various embodiments that include a semiconductor device featuring a semiconductor chip with multiple gold bumps, a substrate with metal wirings connected to these bumps, and a junction that incorporates the tin-bismuth family alloy solder.
Career Highlights
Kang is currently employed at Samsung Electronics Co., Ltd., where he continues to advance his research and development efforts in semiconductor technologies. His work has been instrumental in improving the performance and reliability of electronic devices.
Collaborations
Throughout his career, Uu-Byung Kang has collaborated with esteemed colleagues such as Yong-hwan Kwon and Jong-Ho Lee. These partnerships have fostered innovation and contributed to the success of their projects.
Conclusion
Uu-Byung Kang's contributions to alloy solder technology and semiconductor devices highlight his role as a key innovator in the electronics industry. His work not only enhances device reliability but also paves the way for future advancements in semiconductor technology.