Utku Sonmez

Title: Utku Sonmez: Innovator in Polycarbonate Heat Molding

Introduction

Utku Sonmez is a notable inventor based in Pittsburgh, PA (US). He has made significant contributions to the field of microsystems fabrication through his innovative patent. His work focuses on enhancing the methods used in soft lithography, which is crucial for creating intricate designs in various applications.

Latest Patents

Sonmez holds a patent for "Polycarbonate heat molding for soft lithography." This method involves replicating master molds that are essential in the fabrication of microsystems with features ranging from microns to millimeters. The process utilizes a polymer sheet that is heated and melted onto an elastomeric mold derived from the master mold. This technique allows for the accurate replication of complex geometries, including high aspect ratio features, microposts, and channels with slender sidewalls. Notably, the polymer sheet encases the elastomeric mold without requiring external force, which prevents any deformation of the features during the copying process. He has 1 patent to his name.

Career Highlights

Sonmez is affiliated with Carnegie Mellon University, where he continues to advance his research and innovation in the field of microsystems. His work is instrumental in bridging the gap between theoretical research and practical applications in technology.

Collaborations

One of his notable collaborators is Philip LeDuc, with whom he has worked on various projects that push the boundaries of current technologies in microsystems.

Conclusion

Utku Sonmez is a pioneering inventor whose work in polycarbonate heat molding has the potential to revolutionize the fabrication of microsystems. His contributions to the field are significant and continue to inspire future innovations.