Company Filing History:
Years Active: 2024
Title: Ute Steinhaeusser: Innovator in Acoustic Packaging Technology
Introduction
Ute Steinhaeusser is a prominent inventor based in Munich, Germany. She has made significant contributions to the field of acoustic packaging technology, holding a total of 3 patents. Her innovative work focuses on enhancing the reliability and performance of electronic components.
Latest Patents
One of her latest patents is titled "Electric component with pad for a bump and manufacturing method thereof." This invention provides an improved reliability of a bump connection through a bump pad enclosure that includes an electrode pad, a UBM, and a first shield. The first shield is designed to protect the perimeter area of the electrode pad from environmental influences, thereby enhancing durability.
Another notable patent is "Corrosion resistant pad for enhanced thin film acoustic packaging (TFAP)." This invention outlines an apparatus and method for creating an acoustic filter package. The design includes a base layer, a support layer, and a piezoelectric structure, which features a corrosion-resistant pad that enhances the overall performance of the acoustic packaging.
Career Highlights
Ute Steinhaeusser is currently employed at Rf360 Singapore Pte. Ltd., where she continues to develop innovative solutions in her field. Her work has garnered attention for its practical applications in improving electronic component reliability.
Collaborations
Throughout her career, Ute has collaborated with notable colleagues, including Robert Felix Bywalez and Niklaas Konopka. These partnerships have contributed to her success and the advancement of her projects.
Conclusion
Ute Steinhaeusser is a trailblazer in the realm of acoustic packaging technology, with a focus on enhancing the reliability of electronic components. Her patents reflect her commitment to innovation and her impact on the industry.