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For the Inventor, By the Inventor

Schwäbisch Gmünd, Germany

Ulrich Wieduwilt

This inventor holds 21 USPTO granted patents and 7 published patent applications and 20 EPO patents, primarily in Packaging Technology. Top assignees: Robert Bosch, Syntegon Technology Gmbh. Active years: 2002-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ulrich Wieduwilt. Retrieved from https://idiyas.com/inventor/ulrich-wieduwilt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 

% Patents Active = 66.7

 

Average Co-Inventor Count = 2.2

ph-index = 3

Forward Citations = 30(Granted Patents)


Location History:

  • Schwaebisch, DE (2002 - 2014)
  • Schwaebisch Gmuend, DE (2004 - 2024)

Company Filing History:

goldMedal18 out of 30,245 
 
Robert Bosch
 patents
silverMedal3 out of 58 
 
Syntegon Technology Gmbh
 patents

Years Active: 2002-2024

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Areas of Expertise:
Ultrasonic Joining
Flexible Packaging
Sealing Methods
Packaging Machines
Joining Device
Welding Device
Packaging Materials
Conveyor Apparatus
Processing Device
Cutting Apparatus
Packaging Bag
Sealing Jaw
21 patents (USPTO):Explore Patents
1. 11981470 - Method and device for processing a cover of a package (2024-05-14),
2. 11661223 - Method and device for producing a packaging body of packaging (2023-05-30),
3. 11541623 - Method and apparatus for joining paper material (2023-01-03),
4. 10843833 - Device for sealing a packaging (2020-11-24),
5. 10723096 - Method for producing packaging, and packaging machine (2020-07-28),
6. 9993970 - Cross seam joining device for joining a sealing seam for a flexible packaging (2018-06-12),
7. 9993967 - Method for joining a sealing seam of a tubular bag packaging by means of an ultrasound applicator and longitudinal seal joining device for use with said method (2018-06-12),
8. 9452855 - Separating tool of a joining device for flexible packagings (2016-09-27),
9. 9399332 - Ultrasonic joining method and ultrasonic joining device (2016-07-26),
10. 9399330 - Ultrasonic joining method and ultrasonic joining device (2016-07-26),
11. 9382026 - Apparatus for cutting a packaging material for a package (2016-07-05),
12. 9085392 - Method and device for producing a packaging bag from flexible film material and stiffened partial region and packaging bag (2015-07-21),
13. 9079361 - Device and method for welding and separating packaging materials for a package (2015-07-14),
14. 8919411 - Sealing jaw for sealing a packaging material using ultrasound (2014-12-30),
15. 8795453 - Device and method for processing a packing material using ultrasound (2014-08-05),

Title: Inventor Ulrich Wieduwilt

Introduction: Ulrich Wieduwilt is a renowned inventor based in Schwaebisch Gmuend, Germany, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Ulrich Wieduwilt holds several patents in the areas of renewable energy, sustainable materials, and advanced manufacturing processes, showcasing his commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Ulrich Wieduwilt has worked with leading research institutions and companies to develop cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Ulrich Wieduwilt has collaborated with top engineers, scientists, and designers to bring his innovative ideas to life, resulting in successful products and solutions that have had a significant impact on the market.

Conclusion: Ulrich Wieduwilt's passion for innovation and his dedication to pushing the boundaries of technology make him a true pioneer in the world of inventions. His work continues to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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