Ulrich Speh

Title: Ulrich Speh: Innovator in Circuit Board Technology

Introduction

Ulrich Speh is a notable inventor based in Steinenbronn, Germany. He has made significant contributions to the field of circuit board technology, holding two patents that showcase his innovative approach to substrate treatment and circuit board production.

Latest Patents

One of Ulrich Speh's latest patents is a method of producing a circuit board layer. This method involves using a ceramic foil with a carrier foil that is perforated by laser to create circuit traces and feedthroughs. The process allows for the printing of the circuit trace and the subsequent removal of the carrier foil, enhancing the efficiency of multilayer circuit board production. Another patent focuses on an apparatus for treating substrates. This invention aims to achieve uniform and homogeneous treatment of substrates within a process container that operates in a gas atmosphere. The design includes openings beneath the treatment fluid surface for linear substrate guidance and an overflow for the treatment fluid.

Career Highlights

Throughout his career, Ulrich Speh has worked with prominent companies such as Steag Micro Tech GmbH and Robert Bosch GmbH. His experience in these organizations has contributed to his expertise in the field of circuit board technology and substrate treatment.

Collaborations

Ulrich has collaborated with notable professionals in his field, including Jens Schneider and Marc A Meuris. These collaborations have likely enriched his work and led to further advancements in his inventions.

Conclusion

Ulrich Speh's innovative contributions to circuit board technology and substrate treatment demonstrate his commitment to advancing the field. His patents reflect a deep understanding of the complexities involved in producing efficient and effective circuit boards.