Bruchsal, Germany

Ulrich Schygulla



Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Ulrich Schygulla: Innovator in Micro Heat Exchanger Technology

Introduction

Ulrich Schygulla is a notable inventor based in Bruchsal, Germany. He has made significant contributions to the field of thermal management, particularly through his innovative designs in micro heat exchangers. His work focuses on enhancing the efficiency of heat transfer in electronic components.

Latest Patents

Ulrich Schygulla holds a patent for a micro heat exchanger and its use as a cooler for electronic components. This invention is designed to transfer high area-specific amounts of heat from a heat source to a heat transfer medium. The micro heat exchanger features a heat transfer structure with an inlet and an outlet duct structure, which are arranged in alternating order in close proximity to the heat source. This design allows for effective cooling by ensuring that the inlet and outlet duct structures, along with the passages connecting them, cover the entire heat transfer area adjacent to the heat source.

Career Highlights

Ulrich Schygulla is associated with Forschungszentrum Karlsruhe GmbH, where he has been instrumental in advancing research in thermal management technologies. His expertise in micro heat exchangers has positioned him as a key figure in the development of efficient cooling solutions for electronic devices.

Collaborations

Ulrich has collaborated with notable colleagues, including Klaus Schubert and Jürgen Brandner. These partnerships have contributed to the advancement of innovative technologies in their respective fields.

Conclusion

Ulrich Schygulla's contributions to micro heat exchanger technology exemplify his commitment to innovation in thermal management. His patent and work at Forschungszentrum Karlsruhe GmbH highlight the importance of efficient cooling solutions in modern electronics.

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