Company Filing History:
Years Active: 2002-2004
Title: Ulrich Schoof: Innovator in Grinding Technology
Introduction
Ulrich Schoof is a notable inventor based in Düsseldorf, Germany. He has made significant contributions to the field of grinding technology, holding two patents that showcase his innovative approach to improving grinding processes.
Latest Patents
Schoof's latest patents include a grinding wheel and a grinding system designed for blade sharpening. The grinding wheel features a surface where ions are deposited using a plasma-supported method. It contains silicon carbide as the abrasive medium, with a grain size ranging from 100 to 500 mesh. This material is bonded in a ceramic-based binding agent made of aluminum silicate. The grinding wheel's abrasive medium concentration exceeds 1 volume percent, making it effective for rough grinding blades. Following this, polishing is performed with a second grinding wheel that uses pure corundum as the abrasive medium, with a grain size between 400 to 800 mesh. This second wheel is made with a multicomponent synthetic resin, preferably a phenol resin, with a concentration of over 1 volume percent. Additionally, Schoof has developed an improved doctor rod for coating devices, which enhances the service life of these tools through an innovative ion implantation process.
Career Highlights
Ulrich Schoof is currently employed at Jagenberg Papiertechnik GmbH, where he continues to develop and refine technologies related to grinding and coating processes. His work has significantly impacted the efficiency and effectiveness of these applications in various industries.
Collaborations
Schoof collaborates with talented coworkers, including Hans Rückert and Stefan Reimann, who contribute to the innovative environment at Jagenberg Papiertechnik GmbH.
Conclusion
Ulrich Schoof's contributions to grinding technology through his patents and work at Jagenberg Papiertechnik GmbH highlight his role as a key innovator in the field. His advancements not only improve existing processes but also pave the way for future innovations in grinding and coating technologies.