This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Ulrich Möeller: Innovator in Chip Packaging Technology
Introduction
Ulrich Möeller is a notable inventor based in Holzkirchen, Germany. He has made significant contributions to the field of chip packaging technology, particularly through his innovative patent that enhances the functionality and efficiency of semiconductor devices.
Latest Patents
Möeller holds a patent for "Chip packages including substrate integrated waveguides." This invention involves a chip package that comprises a semiconductor chip and a substrate integrated waveguide. The substrate integrated waveguide features a first metal layer, a second metal layer positioned over the first, and a dielectric substrate situated between the two metal layers. Additionally, the chip package includes a slot formed in the second metal layer and a signal line that electrically connects the semiconductor chip to the second metal layer. Notably, the signal line crosses the slot when viewed from a direction perpendicular to the second metal layer. This innovative design aims to improve signal integrity and reduce losses in high-frequency applications.
Career Highlights
Ulrich Möeller is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to focus on advancing chip packaging technologies, contributing to the company's reputation for innovation in the electronics industry.
Collaborations
Möeller has collaborated with esteemed colleagues such as Ernst Seler and Tuncay Erdöl. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Ulrich Möeller's contributions to chip packaging technology exemplify the impact of innovative thinking in the semiconductor industry. His patent for chip packages with substrate integrated waveguides showcases his commitment to enhancing electronic device performance. Through his work at Infineon Technologies AG and collaborations with fellow inventors, Möeller continues to push the boundaries of technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
