Kierspe, Germany

Ulrich Lindner

This inventor holds 1 USPTO granted patent. Top assignee: Erich Wippermann Gmbh. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ulrich Lindner. Retrieved from https://idiyas.com/inventor/ulrich-lindner-fo0jmtdi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 3.0

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Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Ulrich Lindner: Innovator in Electrical Connector Technology

Introduction

Ulrich Lindner is a notable inventor based in Kierspe, Germany. He has made significant contributions to the field of electrical connector technology, particularly through his innovative patent.

Latest Patents

Lindner holds a patent for an invention titled "Injection-molding an electrical-connector shell." This patent describes a method for creating an electrical-connector shell by first casting a body from a plastic material in a mold. The design features an inner wall and an outer wall that form an annular space, along with an end wall that includes a throughgoing hole. The process involves enclosing this body in a second mold and injecting a second plastic to form an annular seal ring.

Career Highlights

Ulrich Lindner is associated with Erich Wippermann GmbH, where he has applied his expertise in the development of electrical connectors. His work has contributed to advancements in the manufacturing processes of these essential components.

Collaborations

Lindner has collaborated with notable colleagues, including Jürgen Oesterreich and Dieter Kaffenberger. Their combined efforts have fostered innovation within their field.

Conclusion

Ulrich Lindner's contributions to electrical connector technology through his patent demonstrate his commitment to innovation. His work continues to influence the industry and showcases the importance of inventive thinking in engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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