Company Filing History:
Years Active: 2025
Title: Ulises Encarnacion: Innovator in Semiconductor Technology
Introduction
Ulises Encarnacion is a notable inventor based in Tlaquepaque, Mexico. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that addresses critical challenges in the industry.
Latest Patents
Ulises Encarnacion holds a patent for a semiconductor chip package thermo-mechanical cooling assembly. This apparatus includes a back plate and a bolster plate that is secured to the back plate with a back bolt. The bolster plate features a window, and a circuit board is positioned between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus also includes a load stud that emanates from a face of the bolster plate, with the back bolt emanating from the opposite face. Both the load stud and back bolt are oriented along the same axis, which is orthogonal to the faces. Additionally, the apparatus incorporates a heat sink and a loading plate, with the heat sink mounted to the loading plate. The loading plate has a fixturing element that secures it to the bolster plate via the load stud. This innovative design enhances the efficiency of semiconductor cooling systems.
Career Highlights
Ulises Encarnacion is currently employed at Intel Corporation, where he continues to push the boundaries of semiconductor technology. His work at Intel has allowed him to collaborate with some of the brightest minds in the industry, contributing to advancements that benefit a wide range of applications.
Collaborations
Throughout his career, Ulises has worked alongside talented colleagues, including Olaotan Elenitoba-Johnson and Eric Erike. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.
Conclusion
Ulises Encarnacion is a distinguished inventor whose contributions to semiconductor technology are noteworthy. His patent for a thermo-mechanical cooling assembly exemplifies his commitment to innovation. As he continues his work at Intel Corporation, he remains a key figure in advancing the field of semiconductor technology.