This inventor holds 2 USPTO granted patents. Top assignee: Industrial Technology Research Institute. Active years: 2014.
Company Filing History:
Years Active: 2014
Title: Tzu-Ping Cheng: Innovator in Flexible Circuit Board Technology
Introduction
Tzu-Ping Cheng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of flexible circuit board technology, holding 2 patents that showcase his innovative approaches.
Latest Patents
One of his latest patents is a fabricating method of a flexible circuit board. This method involves several steps, starting with a metal carrier foil that has a metal oxide layer on its surfaces. The metal oxide layer is formed through the spontaneous oxidization of the metal carrier foil in ambient air, providing passive protection in sulfuric acid or acidic copper sulfate solutions. A conductive seed layer is then electroplated onto this metal oxide layer. Following this, a flexible insulating layer is created on the conductive seed layer through a polyimide casting process. The metal carrier foil is subsequently peeled off from the conductive seed layer, which is now supported by the insulating layer. Finally, a patterned circuit is formed on the insulating layer through photoresist coating, developing, and etching.
Another significant patent by Cheng is related to a carrier-attached copper foil. This method includes providing a carrier foil made of stainless steel, titanium, aluminum, nickel, or an alloy thereof, which has a surface oxide layer. A copper foil is then formed onto the carrier foil to prepare the carrier-attached copper foil.
Career Highlights
Tzu-Ping Cheng is associated with the Industrial Technology Research Institute, where he continues to advance his research and development efforts in innovative technologies.
Collaborations
He has collaborated with notable coworkers, including Yu-Chung Chen and Yi-Ling Lo, contributing to various projects and innovations in the field.
Conclusion
Tzu-Ping Cheng's work in flexible circuit board technology exemplifies his commitment to innovation and advancement in the electronics industry. His patents reflect a deep understanding of materials and processes that enhance the functionality and reliability of electronic components.