Tzu-No Chen

Title: Tzu-No Chen: Innovator in Chip Package Technology

Introduction

Tzu-No Chen is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of chip package technology, particularly through his innovative designs and methods.

Latest Patents

Tzu-No Chen holds a patent for a "Coupled loop and void structure integrated in a redistribution layer of a chip package." This invention discloses a chip package and method for fabricating the same, which includes a redistribution layer (RDL) featuring a plurality of loop and void structures. The chip package comprises an integrated circuit (IC) die and a package substrate, with the RDL positioned between the IC die and the package substrate. The RDL circuitry connects the IC die to the package substrate, incorporating a first coil formed in a first metal layer and a second coil formed in a second metal layer. A first end of the second coil is coupled to a second end of the first coil by a first via, while the second end of the second coil connects to the IC die.

Career Highlights

Tzu-No Chen is currently employed at Xilinx, Inc., where he continues to develop cutting-edge technologies in chip packaging. His work has been instrumental in advancing the efficiency and performance of electronic devices.

Collaborations

Throughout his career, Tzu-No Chen has collaborated with notable colleagues, including Po-Wei Chiu and Hong Shi. These partnerships have fostered innovation and contributed to the success of various projects.

Conclusion

Tzu-No Chen's contributions to chip package technology exemplify his dedication to innovation and excellence in the field. His patent and ongoing work at Xilinx, Inc. highlight his role as a key player in advancing electronic packaging solutions.