Company Filing History:
Years Active: 2019
Title: Tzu-Chun Lin: Innovator in Substrate Technology
Introduction
Tzu-Chun Lin is a notable inventor based in Changhua County, Taiwan. He has made significant contributions to the field of substrate technology, particularly through his innovative patent that addresses the challenges of substrate removal and adhesion.
Latest Patents
Tzu-Chun Lin holds a patent for a "Device for removing and adhering substrate and method for using the device." This device is designed to efficiently remove a first substrate from a second substrate or adhere the first substrate to the second substrate. The invention includes a carrier for fixing the first substrate, a flexible member for fixing the second substrate, and a supporting member that connects both components. Together, these elements create a first variable pressure chamber, which is equipped with a first air hole, enhancing the functionality of the device. He has 1 patent to his name.
Career Highlights
Tzu-Chun Lin is affiliated with the Industrial Technology Research Institute, where he has been instrumental in advancing research and development in substrate technologies. His work has not only contributed to academic knowledge but also has practical applications in various industries.
Collaborations
Tzu-Chun Lin has collaborated with esteemed colleagues such as Chen-Chu Tsai and Cheng-Yi Wang. Their combined expertise has fostered innovation and development in their respective fields.
Conclusion
Tzu-Chun Lin's contributions to substrate technology through his innovative patent demonstrate his commitment to advancing the field. His work at the Industrial Technology Research Institute and collaborations with fellow researchers highlight the importance of teamwork in driving innovation.