Fremont, CA, United States of America

Tzong I Yeh

This inventor holds 1 USPTO granted patent. Top assignee: Packaging Industries Group, Inc.. Active years: 1989.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tzong I Yeh. Retrieved from https://idiyas.com/inventor/tzong-i-yeh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 1989

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1 patent (USPTO):Explore Patents

Title: Tzong I Yeh - Innovator in Hinge Technology

Introduction

Tzong I Yeh is a notable inventor based in Fremont, California. She has made significant contributions to the field of hinge technology, particularly with her innovative approach to joining surfaces of sheet materials.

Latest Patents

Tzong I Yeh holds a patent for a "Plastic hinge, hinged material, and method for hinging." This invention features a hinge designed to join surfaces of sheet material using a strip of film/foam laminate. The foam layer is tackified through heating, allowing for a heat-sealed bond to the surfaces. The hinge strip is typically made of polyethylene film laminated to polyethylene foam, ensuring that the joined surfaces remain undamaged during the heat lamination process. The resulting waterproof bond is a significant advancement in hinge technology.

Career Highlights

Tzong I Yeh is currently employed at Packaging Industries Group, Inc., where she continues to develop innovative solutions in packaging and material joining. Her work has been instrumental in enhancing the functionality and durability of packaging materials.

Collaborations

Tzong I Yeh collaborates with her coworker, Jack P Erceg, to further advance their projects and innovations in the field.

Conclusion

Tzong I Yeh's contributions to hinge technology exemplify her innovative spirit and dedication to improving material joining methods. Her patent reflects a significant advancement in the industry, showcasing her expertise and commitment to innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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