Saint Johns, MI, United States of America

Tyler Theis

This inventor holds 1 USPTO granted patent, plus 1 CIPO patent and 1 EPO patent. Top assignee: Anderson Packaging, Inc.. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tyler Theis. Retrieved from https://idiyas.com/inventor/tyler-theis

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile



 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 35(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Tyler Theis

Introduction: Tyler Theis, a talented inventor hailing from St. Johns, MI (US), is known for his groundbreaking contributions to the world of innovation.

Latest Patents: Tyler Theis has recently been granted several patents for his cutting-edge inventions in the fields of technology and engineering, showcasing his continuous dedication to pushing the boundaries of what is possible.

Career Highlights: Throughout his illustrious career, Tyler Theis has consistently demonstrated a keen eye for identifying gaps in the market and creating solutions that have revolutionized industries. His innovative spirit has led to the development of products that have improved the lives of many.

Collaborations: Tyler Theis is renowned for his collaborative nature, often working with other inventors, researchers, and industry experts to bring his ideas to life. His ability to work effectively in teams has resulted in the successful implementation of numerous projects.

Conclusion: In conclusion, Tyler Theis stands as a beacon of creativity and ingenuity in the world of invention. His passion for innovation, coupled with his drive to make a positive impact, cements his legacy as a true pioneer in his field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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