Denver, CO, United States of America

Tyler Bower

This inventor holds 1 USPTO granted patent. Top assignee: Texas Instruments Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tyler Bower. Retrieved from https://idiyas.com/inventor/tyler-bower

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tyler Bower and 3D Point-Cloud Generation

Introduction

Tyler Bower is an inventor based in Denver, Colorado, whose patent work includes technology for generating three-dimensional point clouds from spatiotemporal light patterns. He is associated with Texas Instruments Corporation.

Latest Patents

Bower is named on 1 patent: “Methods and Apparatus to Generate Three Dimensional (3D) Point Clouds Based on Spatiotemporal Light Patterns.” The invention describes a controller that creates a sequence of light patterns from tiles, each containing a distinct arrangement of illuminated pixels. A projector displays the patterns, and an image sensor captures images of their reflections. The system then uses those images to generate a three-dimensional point cloud.

Career Highlights

The patent reflects work on combining projected light patterns, image capture, and processor-controlled analysis to produce 3D spatial data. This approach may support applications that rely on depth sensing and three-dimensional scene representation.

Collaborations

Bower’s listed company affiliation is Texas Instruments Corporation. The patent describes coordinated operation among processor circuitry, a projector, and an image sensor.

Conclusion

Tyler Bower’s patent documents an approach to generating 3D point clouds by projecting and analyzing sequences of structured light patterns.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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