Company Filing History:
Years Active: 2020
Title: **Twila Jo Eichman: Innovating Substrate Dielectric Solutions**
Introduction
Twila Jo Eichman, a skilled inventor based in San Marcos, TX, has made significant contributions to the field of substrate technology. With a focus on preventing dielectric cracking, her innovative design highlights the intersection of engineering and practical application.
Latest Patents
Twila holds a patent for her invention titled "Substrate Dielectric Crack Prevention Using Interleaved Metal Plane." This patent presents an advanced substrate design that incorporates multiple metal planes separated by gaps of dielectric material. Notably, the gaps are intricately arranged to reduce the likelihood of dielectric cracking, enhancing the reliability and performance of electronic devices.
Career Highlights
Twila is a key member of NXP USA, Inc., where her expertise in substrate technology continues to flourish. With her inventive approach, she contributes to the development of reliable electronic components essential for modern technology.
Collaborations
Throughout her career, Twila has collaborated with notable colleagues, including Tingdong Zhou and Stanley Andrew Cejka. These partnerships reflect a commitment to innovation and collective problem-solving within the engineering and technology sectors.
Conclusion
Twila Jo Eichman's work exemplifies the importance of innovation in addressing complex engineering challenges. Her patent not only showcases her inventive skills but also contributes to the advancement of technology in the industry, showcasing the critical role of inventors in shaping our technological future.