This inventor holds 2 USPTO granted patents. Top assignee: Nec Corporation. Active years: 1995-1996.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1995-1996
Title: Tutomu Ohshima: Innovator in Multilayered Printed Wiring Boards
Introduction
Tutomu Ohshima is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of printed wiring boards, holding a total of 2 patents. His work focuses on innovative methods of manufacturing multilayered printed wiring boards, which are essential components in modern electronic devices.
Latest Patents
Ohshima's latest patents include a method of manufacturing a multilayered printed wiring board. This invention describes a multilayered printed wiring board that consists of multiple inner layer circuits, ground layers, first insulating layers, a second insulating layer, a surface layer circuit, and a parts mounting pad. The inner layer circuits are arranged parallel to each other in a flat manner within at least one inner layer. Ground layers are formed above and below the inner layer circuits to sandwich them effectively. The first insulating layers are positioned between the ground layers and the inner layer circuits to provide insulation. The second insulating layer is formed on the uppermost ground layer, serving as a surface layer. A surface layer circuit is selectively formed on this second insulating layer, and a parts mounting pad is created in a designated area, featuring a recessed portion for fitting a lead portion of a mounting part. This invention also discloses a method for manufacturing the printed wiring board.
Career Highlights
Tutomu Ohshima is currently associated with NEC Corporation, a leading technology company in Japan. His work at NEC has allowed him to explore and develop advanced technologies in the field of electronics and printed wiring boards.
Collaborations
Ohshima has collaborated with notable coworkers, including Hidebumi Ohnuki and Ryo Maniwa. Their combined expertise has contributed to the advancement of technologies in their respective fields.
Conclusion
Tutomu Ohshima's innovative work in multilayered printed wiring boards has made a significant impact on the electronics industry. His patents reflect a deep understanding of the complexities involved in manufacturing these essential components. His contributions continue to influence the development of modern electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile