Tuo Wang

Title: Tuo Wang - Innovator in Semiconductor Technology

Introduction

Tuo Wang is a prominent inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor technology, particularly in the area of carbon deposition processes. His innovative work has led to advancements that enhance the efficiency and effectiveness of semiconductor manufacturing.

Latest Patents

Tuo Wang holds 1 patent for his invention titled "Carbon deposition-etch-ash gap fill process." This patent describes techniques, systems, and apparatuses for performing carbon gap-fill in semiconductor wafers. The methods involve performing deposition-etching operations in a cyclic manner to fill gap features with carbon. A series of deposition-etching cycles results in a localized build-up of carbon film on the semiconductor wafer's surface near the gap feature. An ashing operation is then conducted to preferentially remove the excess material from the wafer's top surface. This process can be repeated with further groups of deposition-etching cycles, interspersed with additional ashing cycles, to achieve optimal results.

Career Highlights

Tuo Wang is associated with Novellus Systems Incorporated, a company known for its cutting-edge technologies in semiconductor manufacturing. His work at Novellus has positioned him as a key player in the development of innovative solutions that address the challenges faced in the semiconductor industry.

Collaborations

Tuo Wang has collaborated with notable colleagues, including Chunhai Ji and Sirish K Reddy. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Tuo Wang's contributions to semiconductor technology through his innovative patent and collaborative efforts highlight his role as a leading inventor in the field. His work continues to influence advancements in semiconductor manufacturing processes.