Taoyuan, Taiwan

Tung-Chuan Wang


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations of Tung-Chuan Wang in Chip Package Technology

Introduction

Tung-Chuan Wang is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of chip package modules. His innovative approach focuses on improving heat dissipation in power chip packages, which is crucial for enhancing the performance and reliability of electronic devices.

Latest Patents

Wang holds a patent for a "Method of fabricating a chip package module with improved heat dissipation effect." This patent outlines a manufacturing method that utilizes a temporary carrier with an alignment pattern. The process involves placing a circuit board on the temporary carrier, positioning a chip within an accommodating space, and using a peelable adhesive material to secure the chip. The accommodating space is then filled with a molding material to create an initial package structure, which is later separated from the temporary carrier. This innovative method enhances the thermal and electrical conductivity of the chip, thereby improving its overall performance.

Career Highlights

Tung-Chuan Wang is associated with Youngtek Electronics Corporation, where he applies his expertise in chip packaging technology. His work has been instrumental in advancing the company's product offerings and enhancing their competitive edge in the electronics market. Wang's dedication to innovation is evident in his patent, which reflects his commitment to improving electronic device functionality.

Collaborations

Wang collaborates with talented individuals such as Hsi-Ying Yuan and Chun-Yuan Hou. Their combined efforts contribute to the development of cutting-edge technologies in the field of electronics.

Conclusion

Tung-Chuan Wang's contributions to chip package technology exemplify the importance of innovation in the electronics industry. His patented method for improving heat dissipation in chip packages showcases his expertise and commitment to advancing technology. Wang's work continues to influence the development of more efficient electronic devices.

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