Tung-Chang Lin

Title: Innovations of Tung-Chang Lin

Introduction

Tung-Chang Lin is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of circuit board technology. With a total of 2 patents, his work focuses on enhancing the efficiency and functionality of circuit board structures.

Latest Patents

Lin's latest patents include innovative designs for circuit board structures. The first patent describes a circuit board structure that comprises a substrate, a loop-wrapping ground layer, an insulating structure, a first build-up layer, a top wiring layer, a bottom wiring layer, a first conductive via, and multiple second conductive vias. This structure defines a signal transmitting framework, which includes an equivalent circuit with four distinct sections connected in series according to an ABCD transmission matrix series connection principle.

The second patent outlines another circuit board structure featuring a substrate, a first build-up structure layer, and both first and second external circuit layers. This design includes at least one first conductive via and additional second conductive vias. The first conductive via connects the first and second external circuit layers, establishing a signal path, while the second conductive vias create a ground path that surrounds the signal path.

Career Highlights

Tung-Chang Lin is currently employed at Unimicron Technology Corporation, where he continues to innovate in the field of circuit board technology. His work has been instrumental in advancing the capabilities of electronic devices.

Collaborations

Lin collaborates with talented coworkers, including Chih-Chiang Lu and Jun-Rui Huang, contributing to a dynamic and innovative work environment.

Conclusion

Tung-Chang Lin's contributions to circuit board technology through his patents reflect his commitment to innovation and excellence in engineering. His work continues to influence the development of advanced electronic systems.