This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 834,513 Years Active: 2001
Title: **Innovative Contributions of Inventor Tuc Nguyen in Copper Metallization**
Introduction
Tuc Nguyen, an inventive mind based in Vancouver, WA, has made significant contributions to the field of integrated circuit manufacturing. With a focus on enhancing the efficiency of electro-chemical copper metallization, he has secured a patent that addresses crucial aspects of adhesion in electronic components.
Latest Patents
Nguyen's noteworthy patent is titled "Adhesion Promotion Method for Electro-Chemical Copper Metallization in IC Applications". This innovative method introduces a process for promoting adhesion of chemical vapor deposition (CVD) copper to diffusion barrier materials, which is essential in the manufacturing of integrated circuits. The patent outlines a protocol involving the deposition of a first seed layer of copper onto the barrier material using (hfac)Cu(1,5-Dimethylcyclooctadiene) as a precursor. This technique ensures that the copper seed layer adheres strongly to the surfaces, allowing for effective subsequent electrochemical deposition.
Career Highlights
Throughout his career, Tuc Nguyen has focused on advancing technologies associated with integrated circuits. His patent serves as a testament to his dedication and expertise in electro-chemical processes. By facilitating improved adhesion in copper metallurgy, Nguyen's work plays a vital role in enhancing the reliability of modern electronic devices.
Collaborations
Nguyen collaborates with esteemed colleagues Lawrence J. Charneski and Gautam Bhandari. Together, they contribute to the pursuit of innovative solutions within their industry. The synergy and collective knowledge of this team emphasize the importance of collaboration in driving advancements in technology.
Conclusion
Tuc Nguyen's innovative approach to adhesion promotion in copper metallization reflects his commitment to enhancing the manufacturing processes of integrated circuits. His patented method not only showcases his inventive capabilities but also represents a significant step forward in the field, paving the way for more reliable and efficient electronic components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile