St. Louis, MO, United States of America

Tu Q Vo

This inventor holds 1 USPTO granted patent. Top assignee: The Boeing Company. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tu Q Vo. Retrieved from https://idiyas.com/inventor/tu-q-vo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Tu Q Vo

Introduction

Tu Q Vo is a notable inventor based in St. Louis, MO (US). He has made significant contributions to the field of aviation through his innovative designs and patents. His work primarily focuses on wing assemblies and aircraft technology.

Latest Patents

Tu Q Vo holds a patent for wing assemblies, which comprise one or more wing support structures, an inboard-most flap, and one or more flap supports that operatively couple the inboard-most flap to the wing support structure(s). The flap support(s) include at least an inboard-most inboard-flap support that is outboard of the inboard edge of the inboard-most flap. This patent showcases his expertise in enhancing aircraft performance and efficiency.

Career Highlights

Tu Q Vo is currently employed at The Boeing Company, where he continues to develop innovative solutions in the aerospace industry. His work at Boeing allows him to collaborate with some of the brightest minds in aviation technology.

Collaborations

One of his notable coworkers is Kevin Raylin Tsai, who contributes to the innovative environment at Boeing. Together, they work on advancing aircraft technology and improving design efficiency.

Conclusion

Tu Q Vo's contributions to aviation through his patent and work at Boeing highlight his role as an influential inventor in the industry. His innovative spirit continues to drive advancements in aircraft technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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