Hong Kong, China

Tsz Kong Cheung

This inventor holds 1 USPTO granted patent. Top assignee: The Hong Kong Polytechnic University. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsz Kong Cheung. Retrieved from https://idiyas.com/inventor/tsz-kong-cheung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Tsz Kong Cheung: Innovator in Polymer-Bonded Magnetic Materials

Introduction

Tsz Kong Cheung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of magnetic materials, particularly through his innovative patent. His work focuses on enhancing power conversion technologies, which are crucial in various applications.

Latest Patents

Tsz Kong Cheung holds a patent for a unique composition of polymer-bonded magnetic materials. This magnetic composition includes a thermoplastic polymer combined with magnetic powders. The resulting material boasts a tensile strength of greater than 20 N/mm, making it suitable for demanding applications in power conversion.

Career Highlights

Tsz Kong Cheung is affiliated with The Hong Kong Polytechnic University, where he continues to advance research in materials science. His academic background and ongoing projects contribute to the university's reputation as a leader in innovative research.

Collaborations

He collaborates with esteemed colleagues, including Ka Wai Eric Cheng and Yuen Wah Wong. Their combined expertise enhances the research output and innovation potential within their projects.

Conclusion

Tsz Kong Cheung's work in polymer-bonded magnetic materials exemplifies the importance of innovation in technology. His contributions are paving the way for advancements in power conversion applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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