Hiroshima, Japan

Tsuyoshi Watanabe

This inventor holds 1 USPTO granted patent. Top assignee: Mazda Motor Corporation. Active years: 1990.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsuyoshi Watanabe. Retrieved from https://idiyas.com/inventor/tsuyoshi-watanabe-8055rsni

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 24(Granted Patents)


Company Filing History:


Years Active: 1990

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1 patent (USPTO):Explore Patents

Title: Tsuyoshi Watanabe: Vehicle Assembly Invention

Introduction

Tsuyoshi Watanabe is an inventor associated with Hiroshima, Japan, and Mazda Motor Corporation. His recorded patent work addresses equipment for assembling wheel-attaching units on a vehicle assembly line.

Latest Patents

Watanabe is credited with 1 patent: “Apparatus for Assembling Wheel Attaching Unit for Use in Vehicle.” The invention describes a pallet that holds front and rear assemblies at predetermined positions, with adjustable holding portions that can move forward or rearward. A pallet conveyor carries the assemblies through setting and securing areas, while a body conveyor positions and lowers the vehicle body onto them. The apparatus is designed to support the assembly of wheel-attaching units during vehicle production.

Career Highlights

Watanabe’s listed invention focuses on coordinating vehicle-body positioning with the placement of front and rear assemblies. Its adjustable pallet holding portions provide flexibility for setting the assemblies in the intended positions.

Collaborations

Watanabe’s listed coworkers include Shunji Sakamoto and Junichi Usui. His patent is associated with Mazda Motor Corporation.

Conclusion

Tsuyoshi Watanabe’s recorded patent reflects an engineering contribution to vehicle assembly, using adjustable pallet supports and coordinated conveyors to position wheel-attaching assemblies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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