Ogori, Japan

Tsuyoshi Takamiya

USPTO Granted Patents = 2 

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2015-2016

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2 patents (USPTO):Explore Patents

Title: Tsuyoshi Takamiya: Innovator in Support Film Technology

Introduction

Tsuyoshi Takamiya is a notable inventor based in Ogori, Japan. He has made significant contributions to the field of support film technology, particularly in the development of innovative materials used in tape applications. With a total of 2 patents, his work reflects a commitment to advancing the capabilities of adhesive products.

Latest Patents

Takamiya's latest patents include a support film for tape that is designed to enhance the performance of adhesive applications. The first patent describes a support film formed of polyurethane, featuring a barrier layer that incorporates a water-soluble polymer compound and montmorillonite. This barrier layer has a montmorillonite content ranging from 2 to 22 percent by weight. The second patent also focuses on a support film for tape, which includes a film-shaped support made of polyurethane, a barrier layer containing polyvinyl alcohol and a layered inorganic compound, and an undercoat layer that facilitates adhesion between the support and the barrier layer.

Career Highlights

Throughout his career, Tsuyoshi Takamiya has worked with prominent companies such as Hisamitsu Pharmaceutical Company, Inc. and Toppan Printing Co., Ltd. His experience in these organizations has allowed him to refine his expertise in material science and adhesive technologies.

Collaborations

Takamiya has collaborated with several talented individuals in his field, including Yasunori Takada and Tsuguki Nishihara. These collaborations have contributed to the innovative advancements in the products he has developed.

Conclusion

Tsuyoshi Takamiya's contributions to support film technology demonstrate his dedication to innovation in adhesive materials. His patents reflect a deep understanding of material properties and their applications in real-world scenarios.

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