Taoyuan, Taiwan

Tsung-Yeh Liu


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Inventor Profile: Tsung-Yeh Liu from Taoyuan, TW

Introduction

Tsung-Yeh Liu is an innovative inventor located in Taoyuan, Taiwan. He has made significant contributions to the field of thermodynamics and fluid mechanics through his inventive mind. With a focus on enhancing heat dissipating technologies, his work illustrates the intersection of creativity and practical application.

Latest Patents

Tsung-Yeh Liu holds a patent for a "Microchannel structure and heat sink having the same." This patent proposes a novel microchannel structure that includes multiple fluid-guiding channels, designed to optimize the flow of refrigerant fluid. The design features an arc-shaped fluid-guiding end corner that connects to fluid-guiding channels, which enhances the heat dissipation capability of the heat sink without necessitating an increase in the power of circulation pumps. This invention is poised to improve the efficiency of heat management systems, benefiting a variety of industries.

Career Highlights

Tsung-Yeh Liu works at the National Chung Shan Institute of Science and Technology, where he is engaged in advanced research and development. His focus on microchannel structures illustrates his commitment to innovation and excellence in engineering design. The patent he holds is a testament to his abilities as an inventor and his dedication to pushing the boundaries of thermal management solutions.

Collaborations

In his professional journey, Tsung-Yeh Liu has collaborated with other talented individuals such as Cheng Hua Lin and Jing-Hong Chen. These partnerships enhance his research output, allowing for diverse viewpoints and expertise to influence the development of new inventions and technologies.

Conclusion

Tsung-Yeh Liu represents the spirit of innovation in the field of heat management and fluid dynamics. His patent showcases a forward-thinking approach to technology that holds the potential to revolutionize thermal applications. With his ongoing research at the National Chung Shan Institute of Science and Technology, he continues to pave the way for future innovations.

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